氯离子浓度对微晶磷铜阳极电化学行为的影响  

The effect of chlorideion concentration on the electrochemical behavior of microcrystalline phosphorous copper anode

作　　者：李劲军 谭发棠 张明义 黎科[2] 陈世荣[2] 文吴健 

机构地区：[1]佛山市承安铜业有限公司,广东佛山528203 [2]广东工业大学,广东广州510006

出　　处：《印制电路信息》2016年第A01期109-113,共5页Printed Circuit Information

摘　　要：氯离子在酸性硫酸盐镀铜液中含量虽低，但对镀层有明显影响。文章通过阳极极化曲线和循环伏安法，对微晶磷铜阳极在不同氯离子浓度的酸性硫酸盐镀铜液中进行了电化学行为的研究。结果表明：微晶磷铜阳极材料在0．002％－0．008％氯离子浓度下，其临界电流较高，可在更大的电流密度下使用，有利于提高镀铜生产效率。The concentration of chlorideion was low in acidic sulfate copper plating bath, but the chlorideion had a significant effect on the coating. The electrochemical behavior of microcrystalline phosphorous copper anode in acid copper plating bath with different chlorideion concentration were studied by anodic polarization curves and cyclic voltammetry. The results showed that in the 0.002%-0.008% chlorineion concentration, the critical current density of microcrystalline phosphorous copper anodes was higher, so it can be used at higher current density and it is propitious to raise the efficiency of plated copper.

关 键 词：微晶磷铜阳极 氯离子 电化学 酸性镀铜 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]