环氧电子封装材料的性能研究  

Research on performance of epoxy electronic packaging material

作　　者：孙安[1] 周浩然[2] 

机构地区：[1]无锡工艺职业技术学院,宜兴214206 [2]哈尔滨理工大学,哈尔滨150040

出　　处：《化工新型材料》2016年第3期172-174,共3页New Chemical Materials

摘　　要：采用超声振动共混、水浴加热方法成功制得环氧树脂灌封材料,通过分析可知环氧树脂固化完全;采用DMA对体系热力学性能分析表征,确定了酸酐用量;通过电学性能分析,测试环氧电子灌封料的介电损耗和体积电阻率,结果表明其性能完全满足灌封料要求,固化工艺可行。Prepared the encapsulating material of epoxy resin with the method of sonic oscillation and heating in water bath.By analysis,it can be concluded that the epoxy resin was solidified completely.The analysis of thermodynamic property with DMA determined the usage of anhydride.The dielectric loss and mass resistivity were tested by the electrical property.All the results showed that the properties can satisfied the reguests of encapsulating materials and the curing process was feasible.

关 键 词：环氧电子灌封料 固化工艺 促进剂 甲基纳迪克酸酐 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]