多芯片组件技术研究  

Study on Technology of Multi Chip Module

作　　者：单作鹏 

机构地区：[1]中国电子科技集团公司第四十七研究所,沈阳110032

出　　处：《微处理机》2016年第2期20-23,共4页Microprocessors

摘　　要：多芯片组件MCM(Multi—Chip Module)技术是将多个裸芯片和其它元器件组装在同一块多层互连基板上,然后进行封装,从而形成高密度和高可靠性的微电子组件。MCM是20世纪80年代初开发成功的新技术,它的前身是紧随着IC发明后出现的传统混合封装技术。其与单芯片相比较具有封装效率高、芯片间距小、芯片和电路板之间的互连数少、高产量的MCM成本低的优点。多芯片组件共有三种基本类型:多层有机层压板结构(MCM-L)、厚膜或多层共烧陶瓷技术(MCM-C)、淀积多芯片组件(MCM-D)。其互联方式共有三种:引线键合、倒装芯片和载带自动焊(TAB)。目前MCM技术在电子系统中得到了广泛应用,但与国外先进水平相比仍存在较大差距。The technology of Multi Chip Module( briefly called MCM) is performed to assemble multiple chips and components on the same piece of interconnect substrate,and then package them to form a high density and reliability of microelectronic components. MCM,as a new technology,was successfully developed in 1980 s,which closely following the traditional hybrid packaging technology IC. Compared with the single chip,it has the advantages of high efficiency,small chip spacing,low interconnection between the chip and the circuit board,and high output MCM low cost. There are three basic types of MCU,i. e. multilayer organic laminate structure( MCM- L),thick film or multilayer co- fired ceramic technology( MCM- C) and deposited multichip module( MCM- D). The interconnect types are wire bonding,flip chip and load tape automated bonding( TAB). At present,MCM technology has been widely used in electronic system,but there is still a big gap compared with foreign advanced technology.

关 键 词：基本类型 互连方式 散热 电测试 发展趋势 

分 类 号：TN45[电子电信—微电子学与固体电子学]