激光选区烧结超高分子量聚乙烯工艺及性能  

Process and properties of selective laser sintering ultrahigh molecular weight polyethylene

作　　者：肖泽锋[1] 杨永强[1] 宋长辉[1,2] 郑潇剑[1] 余家阔[2] 

机构地区：[1]华南理工大学机械与汽车工程学院,广东广州510640 [2]北京大学第三医院运动医学研究所,北京100083

出　　处：《光学精密工程》2016年第3期502-510,共9页Optics and Precision Engineering

基　　金：国家自然科学基金资助项目(No.81327001);北京市科技计划资助项目(No.Z131100005213004);中国博士后基金(No.2015M570902)

摘　　要：研究了激光选区烧结(SLS)成型工艺中不同工艺参数以及后续热处理工艺对超高分子量聚乙烯(UHMWPE)材料成型性能的影响。通过调整扫描间距、激光功率、扫描速度等不同工艺参数,描述了SLS成型UHMWPE零件的致密度、拉伸强度以及断裂伸长率,并对热处理前后的SLS成型UHMWPE零件的力学性能进行了比较。结果显示,致密度、拉伸强度、断裂伸长率总体上与激光功率呈正相关关系,与扫描间距、扫描速度呈负相关关系。经热处理后,SLS成型UHMWPE零件的力学性能有明显提高,致密度达到95.12%,抗拉强度达到24.08 MPa,断裂伸长率达到334.82 MPa。实验结果表明:SLS成型UHMWPE零件与模塑成型UHMWPE零件性能尚有差距,仅优化成型工艺不足以得到理想性能,但经热处理后,零件性能基本满足使用要求。The effects of different processing parameters in Selective Laser Sintering （SLS） and subsequent heat treatment on the mechanical properties of Ultrahigh Molecular Weight Polyethylene （UHMWPE） specimens were investigated. By adjusting the different processing parameters, such as scanning space, scanning speed and laser power, the density, tensile strength and breaking elongation of UHMWPE specimens fabricated by SLS were described, then the mechanical properties of the UHMWPE specimens with and without heat treatments were compared. The experimental result demonstrates that the relative density, tensile strength and the breaking elongation have a positive correlation with the laser power and have a negative correlation with the scanning space and scanning speed. After heat treating, the mechanical properties of the UHMWPE specimens are improved obviously and the relative density, tensile strength and the breaking elongation are 95.12%, 24.08 MPa, and 334.82 MPa respectively. These results suggest that the mechanical properties of UHMWPE specimens fabricated by SLS is weaker than that fabricated by molding. Process optimization can not get the ideal performance, but the mechanical property can be enhanced to meet the requirements after heat treatment.

关 键 词：激光技术 激光选区烧结 超高分子量聚乙烯 力学性能 致密度 

分 类 号：TN249[电子电信—物理电子学]