铜/石墨烯柱结构热导的分子动力学研究  

Thermal Conductance of Cu/Pillared-Graphene Composites by Molecular Dynamics

作　　者：王立莹[1] 黄正兴[1] 唐祯安[1] 

机构地区：[1]大连理工大学电子科学与技术学院,辽宁大连116024

出　　处：《电子器件》2016年第1期1-5,共5页Chinese Journal of Electron Devices

基　　金：国家自然科学基金重点项目(61131004);中央高校基本科研业务费项目(DUT14LAB11)

摘　　要：近年来,散热已经成为电子器件的一个重要课题,其中热界面材料受到人们的广泛重视。为了进一步改进热界面材料的性能,采用分子动力学方法计算了碳纳米管与石墨烯复合结构——石墨烯柱的热学特性。结果表明,结构的热学性能可以通过石墨烯层间的纳米管数目加以调节,随着纳米管数目的增多,结构的热导增加并逐渐达到一个饱和值,该值比石墨烯结构的热导大了约50%。这个结果为热界面材料的进一步优化提供了重要的参考。In recent years,the heat dissipation has become one of the most important topics of electron device,in which the thermal interface material has is widely paid attention by industry and researchers. With the purpose of perfect the performance of thermal interface materials,molecular dynamics method is used to calculate the thermal properties of pillared-graphene structure,a kind of composite structure composed by carbon nanotubes and gra？phene. The results show that the thermal properties of the structure could be controlled by the number of carbon nanotubes：the thermal conductance of the structure increased with the increasing number of carbon nanotubes,and reached a saturated value,which is 50%larger than the thermal conductance of the graphene structure. The result provides an important reference of thermal interface materials in the further research.

关 键 词：导热性 石墨烯柱 分子动力学模拟 

分 类 号：O482.22[理学—固体物理]