有机硅改性水性醇酸树脂的制备及性能研究  

Preparation and properties of waterborne silicone-modified alkyd baking paint

作　　者：李鹏浩[1] 李培礼 朱广军[1] 

机构地区：[1]南京理工大学化工学院,江苏南京210094

出　　处：《现代化工》2016年第4期137-140,共4页Modern Chemical Industry

摘　　要：以甲基三乙氧基硅烷（MTES）、正硅酸四乙酯（TEOS）等为主要原料合成有机硅低聚物,以亚麻油、三羟甲基丙烷（TMP）、1,2,4-苯三酸酐（TMA）等为主要原料合成醇酸树脂,再用有机硅低聚物对醇酸树脂进行改性,最终得到有机硅改性水性醇酸树脂。利用FT-IR、TGA、GPC等手段对其进行结构表征和性能测试。确定有机硅低聚物的合成温度为50℃,醇酸烘烤漆合成温度为230℃,引入亲水扩链剂的温度为180℃,终点酸值控制在45～60 mg（KOH）/g为最佳。水性醇酸树脂的平均粒径为15.09 nm,PDI为0.265,粒径分布集中存储稳定性能好。有机硅的引入增强了固化涂膜的热稳定性,涂膜失重20%时的温度由322℃提高到357℃。失重50%时的温度由475℃提高到621℃。有机硅质量分数为12%时,制备的水溶性有机硅改性水性醇酸树脂的性能最优。Silicone oligomer is synthesized through the reaction between methyltriethoxysilane（ MTES） and tetraethyl orthosilicate（ TEOS）. Waterborne alkyd resin is also prepared with linseed oil,trimethylolpropane（ TMP） and trimellitic anhydride（ TMA） as main raw materials. Then,the as-prepared silicone oligomer is used to modify alkyd resin to obtain silicone modified waterborne alkyd resin. FT-IR,DSC,TGA and GPC are employed to characterize the chemical structure of silicone modified waterborne alkyd resin. The resultant waterborne alkyd resin has an average particle size of15. 09 nm and PDI of 0. 265 under the following conditions： 50 ℃ for synthesis of silicone oligomer,230℃ for preparation of alkyd resin based baking paint,180℃ for incorporation of hydrophilic chain extender and 45- 60 mg KOH / g of acid value. The particle size distribution and storage stability of the obtained waterborne alkyd resin are excellent. The introduction of silicone greatly improves the thermal stability of the coating film. 20% Weight loss of the coating results in the increase of temperature from 322 ℃ to 357 ℃,and 50% weight loss temperature causes the increase of temperature from 475℃ to 621℃. The best performance of silicone-modified water-soluble alkyd baking paint can be achieved when 12% of silicone oligomer is added.

关 键 词：水性 有机硅 低聚物 醇酸树脂 烘烤漆 

分 类 号：TQ637[化学工程—精细化工]