热压温度对PTFE/GF复合基板性能的影响  

Effect of Hot pressing Temperature on the Properties of Polytetrafluoroethylene(PTFE)/Woven Glass Fiber(GF) Microwave Composites Substrate

作　　者：杨熙[1] 杨俊[1] 于丁丁 尹玉婷[1] 袁颖[1] 许绍俊 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054

出　　处：《压电与声光》2016年第2期293-297,共5页Piezoelectrics & Acoustooptics

基　　金：中央高校基本科研业务费专项基金资助项目(ZYGX2012J035)

摘　　要：采用热压工艺制备聚四氟乙烯/玻纤布微波复合介质基板。系统研究了热压温度对聚四氟乙烯/玻纤布复合基板吸水率、介电性能、热膨胀系数及显微结构的影响。采用差示扫描量热法研究玻纤布对聚四氟乙烯的热行为影响。采用矢量网络分析仪对聚四氟乙烯/玻纤布复合基板介电性能进行测试,发现370℃热压的样品具有较低的介电常数与介电损耗（εr=2.2,tanδ=8.7×10-4）。采用热机械分析法（TMA）测量不同热压温度制备的聚四氟乙烯/玻纤布复合介质基板z轴的热膨胀系数,发现370℃时热压制备的复合介质板具有最低的热膨胀系数（CTE=160.1×10-6/℃,1～100℃）。The polytetrafluoroethylene（PTFE）/woven glass fiber（GF）composite substrates were prepared by the hot pressing process under a certain pressure.The effect of the hot pressing temperature on the absorption,dielectric properties,coefficient of thermal expansion（CTE）and the morphology of the composites were systematically investigated.The differential scanning calorimetry（DSC）method was used to study the whole process of the composites manufacture.The morphology of the composites and the distribution of the glass fiber on PTFE was also comfirmed by fracture surface analysis of scanning electronic microscope.The Vector Network Analyzer was employed to study the dielectric properties.The research results showed that when the hot pressing temperature is370 ℃,the desired dielectric constant and low dielectric loss（εr=2.2,tanδ=8.7×10-4）were obtained in the hot pressing glass fiber/PTFE composites.Thermomechanical analysis was utilized to measure the coefficient of thermal expansion of the composites,and revealed the lowest coefficient of thermal expansion（160.1×10-6/℃ @1～100 ℃）was obtained in the GF/PTFE composites under the hot pressing temperature of 370 ℃.

关 键 词：聚四氟乙烯 玻纤布 微波复合基板 热压温度 

分 类 号：TN384[电子电信—物理电子学]