低挥发份LED灯丝胶的制备  

Preparation of Low Volatile LED Filament Encapsulant

作　　者：张生 黄惜和 苏乐 

机构地区：[1]汕头市骏码凯撒有限公司,广东汕头515000

出　　处：《广东化工》2016年第8期65-66,61,共3页Guangdong Chemical Industry

摘　　要：利用FTIR对LED灯丝灯油状物进行分析,结合超高效聚合物色谱(APC),通过响应面试验优化配比及工艺参数,得出最佳的工艺条件为H/Vi=1.53,Process=Yes,在此条件下LED灯丝封装胶的高温失重率由的3.23%降低为1.83%,极大地降低了封装胶的高温挥发份,对提高封装后的LED灯丝灯的可靠性有明显帮助。He oily substance from LED filament lamp were analyzed by FTIR, and the formulation and process parameters were optimized through response surface experiments, combined with Advanced polymer chromatography. The high temperature weight loss of LED filament encapsulant was reduced from 3.23 % to 1.83 % under the optimal process conditions： H/Vi=1.53, Process=Yes, which had greatly reduced the high temperature volatiles of the encapsulant, and is helpful to improve the reliability of the LED filament lamp after encapsulation

关 键 词：LED灯丝灯 FTIR APC 响应面试验 

分 类 号：TQ534[化学工程—煤化学工程]