三价铬硬铬电镀的影响因素  

Factors affecting trivalent hard chromium plating

作　　者：李家柱[1] 李艳景 田孝华 赵新 邹玲 孙宁 侯蔚 李文刚 

机构地区：[1]北京蓝丽佳美化工科技中心,北京100096 [2]武汉迪赛环保新材料股份有限公司,湖北武汉430074 [3]中国兵器工业新技术推广研究所,北京100089 [4]内蒙第一机械集团有限公司,内蒙古包头014030

出　　处：《电镀与涂饰》2016年第8期398-401,共4页Electroplating & Finishing

摘　　要：采用赫尔槽试验、化学分析等方法研究了影响BSC12型三价铬镀硬铬工艺的阴极电流效率、沉积速率、走位能力以及覆盖能力的因素。结果表明,镀液p H为2.0左右时走位效果最好,工作温度为30~50°C之间可以获得30%以上的电流效率。该工艺的沉积速率一般在1μm/min以上。The factors affecting the cathodic current efficiency, deposition rate, throwing power and covering power of BSC12-type trivalent hard chromium plating bath were studied by Hull cell test and chemical analysis methods. The results showed that the bath has the best throwing power at p H ca.2.0. The current efficiency is at least 30% when plating at 30-50 °C. The chromium deposition rate is generally higher than 1 μm/min.

关 键 词：三价铬电镀 硬铬 电流效率 沉积速率 分散能力 覆盖能力 

分 类 号：TQ153.11[化学工程—电化学工业]