HEDP溶液体系无氰镀铜配方优化  

Optimization of HEDP-based bath formulation for cyanide-free copper plating

作　　者：秦足足 李建三[1] 徐金来 

机构地区：[1]华南理工大学机械与汽车工程学院,广东广州510640 [2]广州鸿葳科技股份有限公司,广东广州510663

出　　处：《电镀与涂饰》2016年第7期345-350,共6页Electroplating & Finishing

基　　金：广州市科技型中小企业技术创新基金(2014J4200025)

摘　　要：通过赫尔槽试验研究了主盐、导电盐和添加剂含量对HEDP(羟基乙叉二膦酸)溶液体系无氰镀铜液分散能力和镀层光亮度的影响,得到最佳配方和工艺条件为:HEDP 210 g/L,Cu_2(OH)_2CO_3·H_2O 7.7 g/L,KOH 87 g/L,K_2CO_3 155 g/L,添加剂T04 6.0 mg/L,添加剂T_(12) 3.7 mg/L,添加剂T_(15) 0.4 mg/L,pH 10.5,温度50°C,空气搅拌。该条件下所得镀层颜色均匀,接近光亮,结晶细致、均匀,结合力良好。The effects of the contents of main salt, conductive salt and additive on the throwing power of HEDP（1-hydroxyethane-1,1- diphosphonic acid）-based cyanide-free copper plating bath and the brightness of the copper coating obtained therefrom were studied by Hull cell test. The optimal bath composition and process conditions are as follows： HEDP 210 g/L, Cu2（OH）2CO3·H2O 7.7 g/L, KOH 87 g/L, K2CO3 155 g/L, additive T（04） 6.0 mg/L, additive T（12） 3.7 mg/L, additive T（15） 0.4 mg/L, temperature50 °C pH 10.5 and air agitation. The copper coating obtained under the given conditions features uniform color, nearly bright appearance, compact and uniform crystallization and good adhesion to the substrate.

关 键 词：无氰镀铜 羟基乙叉二膦酸 添加剂 赫尔槽试验 光亮度 分散能力 

分 类 号：TQ153.14[化学工程—电化学工业]