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作 者:张健[1] 陈国宏[2] 王若民[2] 缪春辉[2] 郑治祥[1] 汤文明[1]
机构地区:[1]合肥工业大学材料科学与工程学院,合肥230009 [2]国网安徽省电力公司电力科学研究院,合肥230601
出 处:《功能材料》2016年第5期201-206,共6页Journal of Functional Materials
基 金:国家电网科技攻关资助项目(2012QTXM0751)
摘 要:二次浸Zn是Al材电镀的前处理工艺。Al材碱蚀不当,将对浸Zn乃至后续的电镀过程产生十分不利的影响。研究了在不同浓度NaOH碱蚀液中碱蚀粗化后的纯Al基材及随后二次浸Zn层的表面形貌,并考察了Al材表面电镀Cu层的质量。结果表明,当碱蚀液浓度20g/L,浸渍时间1min时,Al基材表面形成大而深的腐蚀坑,Al基材晶界处腐蚀尤其严重,浸Zn层难以将这些腐蚀坑覆盖。而当碱蚀液浓度5g/L时,在相同的浸渍时间下,Al基材表面粗糙度适中,无大而深的腐蚀坑,浸Zn层覆盖率高达95%以上,其表面电镀Cu层的质量良好。Twice zinc dipping is the pretreatment process for electroplating the pure aluminum and alloys. If alka-li erosion of A1 is not suitable, it has a negative effect on the zincking, even subsequent electroplating process ofthe Al substrate. After etching in the NaOH aqueous solutions with different concentrations and secondary zincdipping, surface morphologies of the pure A1 substrates and the Zn layer were observed. And thus, the qualityof the Cu plating layer on the A1 substrate is also evaluated. The results show that big and deep corrosion holesare formed on the A1 substrate surface, especially at the A1 boundaries, when etching in the 20 g/L NaOHaqueous solution for 1 rain. These holes can not be filled by the Zn deposited particles in the secondary zinc dip-ping process. However, as the concentration of the NaOH solution decreased to 5 g/L, the holes on Al substrate surface are smaller and more shallow than the former, when the Al substrate dipping in the solution forthe same time. Roughness of the etched surface is modest, which is beneficial to the secondary zinc dipping ofthe Al substrate. The Zn layer has a coverage ratio more than 95 %, and the electroplating Cu layer on it is veryfine.
分 类 号:TQ153.1[化学工程—电化学工业]
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