基于功能细分的硅通孔容错方法  

A TSV Fault-Tolerance Method Based on Functional Segmentation

作　　者：杜高明[1] 曹舒婷 张多利[1] 宋宇鲲[1] 高明伦[1] 

机构地区：[1]合肥工业大学微电子所,安徽合肥230009

出　　处：《微电子学与计算机》2016年第5期142-146,152,共6页Microelectronics & Computer

基　　金：国家自然科学基金项目(61106020)

摘　　要：硅通孔(Through Silicon Via,TSV)技术是现今主流的三维芯片上下层互联技术之一.将从三维片上网络(Network on Chip,NoC)垂直通道的功能细分入手:按照TSV重要性的不同划分成组,对不同的TSV组配置不同的冗余配置比.在现有的"包-连接电路"(PCC)平台上完成的实验显示,该冗余容错方案保证了在TSV总数达到十万量级时,成品率依然高达99.999 99%的同时,面积开销与非功能细分方案相比优化了35%以上.Through Silicon Via （TSV） technology is the mainstream of interconnection technology on 3-D stacked chips, this article implements a fault-tolerance scheme based on functional segmentation for vertical channel on 3D- NoC chips., according to the difference of importance of TSVs, we divide these TSVs into groups and configure different redundant proportion. The relevant experiments on PCC platform have shown that the fault-tolerant scheme keeps the target yield of 99. 9999% when the number of TSVs reaches hundred thousand of magnitude and reduces the area overhead compared with other schemes based on non-functional segmentation by 35%.

关 键 词：三维片上网络 硅通孔 容错 功能细分 

分 类 号：TN431.2[电子电信—微电子学与固体电子学] TN47