添加剂对压电陶瓷表面化学镀金工艺的影响  

Influence of Additives on Electroless Gold Plating Process on Piezoelectric Ceramic Surface

作　　者：赵林南 张娜[2] 张颖[3] 田栋[3] 陶珍东[1] 

机构地区：[1]济南大学材料科学与工程学院,山东济南250022 [2]北京化工大学,北京100029 [3]济南大学化学化工学院,山东济南250022

出　　处：《材料保护》2016年第4期33-35,6-7,共3页Materials Protection

基　　金：山东省优秀中青年科学家研究奖励基金(2014BSB01272)资助

摘　　要：为了提高压电陶瓷表面无氰化学镀金工艺的镀速,改善镀层的性能,在其镀液中分别添加聚丙烯酰胺和聚乙二醇进行化学镀金。通过质量差法、扫描电镜(SEM)、X射线衍射仪(XRD)以及腐蚀试验,研究了这2种添加剂对镀速、镀层形貌、晶相结构及耐腐蚀性的影响。结果表明:加入聚乙二醇1.5 g/L或聚丙烯酰胺2.0 g/L时,化学镀镀速较高,镀层性能较好;在最佳浓度条件下,添加聚乙二醇时镀速较高,而添加聚丙烯酰胺时镀层耐腐蚀性好。In order to raise the plating speed of the electroless Ni-Au-P plating without cyanide on the piezoelectric ceramic and improve the performance of coating,polyacrylamide and polyethylene glycol were added into the solution as additives,respectively.The poor quality test,scanning electron microscope(SEM),X-ray diffractometer(XRD),and corrosion test were used to study the influences of two kinds of additives on the plating speed,morphology,phase structure and corrosion resistance of the coating.Results showed that with the 1.5 g/L polyethylene glycol or 2.0 g/L polyacrylamide,the chemical plating speed was higher and performance of coating were better.Under the optimal concentrations,adding polyethylene glycol led to higher plating speed,while adding polyacrylamide led to hetter corrosion resistance of coating.

关 键 词：化学镀金 压电陶瓷 聚乙二醇 聚丙烯酰胺 镀速 镀层性能 

分 类 号：TB306[一般工业技术—材料科学与工程]