氮化铝颗粒增强铜基复合材料的制备及性能  

Preparation and properties of Al N particles reinforced Cu-base composites

作　　者：张煜[1] 宋美慧[1] 李岩[1] 李艳春[1] 张晓臣[1] 

机构地区：[1]黑龙江省科学院高技术研究院,哈尔滨150020

出　　处：《黑龙江科技大学学报》2016年第1期48-52,共5页Journal of Heilongjiang University of Science And Technology

基　　金：哈尔滨市应用技术与研究与开发项目(2013AA4AG003)

摘　　要：针对铜合金热膨胀系数高、密度大的问题,通过粉末冶金工艺制备氮化铝增强铜基复合材料Al N_p/Cu,研究Al N体积分数及制备工艺对其组织结构及性能的影响。结果表明:当压力相同时,随着Al N体积分数增大,复合材料硬度增大,密度、电导率和热膨胀系数减小;当Al N体积分数相同时,随着压制压力升高,复合材料的密度、硬度、电导率和热膨胀系数均增大。当压力超过500 MPa时,材料性能趋于稳定。实验证实Al N可较好改善铜基体的性能。This paper seeks to overcome higher thermal expansion coefficient and higher density of copper alloy. The study works toward preparing AlNp/ Cu composites by means of powder metallurgy and investigating the effect of AlN content and preparation process on the structure and properties of AlNp/ Cu composites. The results reveal that with the same pressure,an increase in AlN content is followed by a decrease in density,electrical conductivity and coefficient of thermal expansion; with same AlN content,an increase in the pressing pressure is associated with an increase in the hardness of the composites,density,electrical conductivity and coefficient of thermal expansion of the composites; and with the pressure exceeding 500 MPa,the composites tend to have a stable performance. It follows that AlN gives an improved performance to copper matrix.

关 键 词：AlNP/Cu 粉末冶金 组织 硬度 密度 电导率 热膨胀系数 

分 类 号：TB331[一般工业技术—材料科学与工程]