氰酸酯/联苯型环氧树脂共混体系的DSC研究  

Study on the Cyanate Ester/Biphenyl Type Epoxy Resin Blend Systems by DSC

作　　者：曹伟[1] 高堂铃[1,2] 王冠[1,2] 高洁[1] 付刚[1,2] 吴健伟[1,2] 张广艳[1,2] 匡弘[1,2] 

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040 [2]黑龙江省科学院高技术研究院,黑龙江哈尔滨150020

出　　处：《化学与粘合》2016年第3期171-175,共5页Chemistry and Adhesion

摘　　要：采用非等温差示扫描量热法对氰酸酯/联苯型环氧树脂共混体系的固化反应动力学、特征温度、转化率和玻璃化转变温度(Tg)进行了研究。共混体系的表观活化能随着联苯型环氧树脂量的增加而降低,质量比为80/20树脂体系的表观活化能为88.6k J·mol^(-1),高于80/20氰酸酯/双酚A型环氧树脂体系的表观活化能。当固化程度接近完全时,80/20共混体系的Tg为249.2℃,比80/20氰酸酯/双酚A型环氧树脂体系的Tg值高出24.3℃。催化剂的加入能使共混体系的表观活化能下降约20k J·mol^(-1),反应特征温度降低约100℃,同时对Tg影响较小。The curing kinetics, characteristic temperatures, conversion rates and glass transition temperatures （Tg） of cyanate ester/biphenyl epoxy resin blend systems were investigated by the use of differential scanning calorimetry. The apparent activation energy of the hlend systems decreased as the amount of biphenyl epoxy resin increased. The apparent activation energy of the blend system with a mass ratio of 80/20 was calculated to be 88.6kJ·mol-l, higher than that of cyanate ester/bisphenol A epoxy resins blend system with the same mass ratio. When the curing was almost completed, the Tg of cyanate ester/biphenyl epoxy resin blend system with a mass ratio of 80/20 was measured to be 249.2℃, which was higher than that of cyanate ester/bisphenol A epoxy resin blend system with a mass ratio of 80/20 by 24.3℃. The addition of a catalyst would decrease the apparent activation energy by 20kJ ·mol-1 for the cyanate ester/biphenyl epoxy resin blend system with a mass ratio of 80/20, and lower the characteristic temperature by 100℃, and it had little effect on the Tg.

关 键 词：联苯型环氧树脂 氰酸酯 DSC 固化反应动力学 

分 类 号：TQ322.41[化学工程—合成树脂塑料工业]