短路过孔对多层PCB信号传输特性的影响  

Influences of Shorting Via to Signal Transmission Characteristics in Multilayer PCB

作　　者：温舒桦[1] 张金玲[1] 胡玉生[2] 

机构地区：[1]北京邮电大学电子工程学院 [2]集美大学机械与能源学院

出　　处：《安全与电磁兼容》2016年第2期65-67,86,共4页Safety & EMC

摘　　要：在相同电位的参考层放置短路过孔影响信号的回流电感,以典型的"地-电源-地"叠层为基础,提取了高频信号的返回路径,计算了短路过孔参数对输入阻抗和信号传输质量的影响。结果表明:短路过孔能有效的改善信号传输特性和电源地平面的边缘电磁辐射,降低了潜在的电磁干扰。The shorting via placed in the same potential layers will change the loop inductance of signal. For a typical ＂ground-powerground＂ structure, the return path of high frequency signal has been extracted, the S parameter and transient impedance has been calculated. The results show that the shorting via can effectively improves the signal transmission characteristics and the electromagnetic radiation of power ground planes, it reduces the potential electromagnetic interference.

关 键 词：短路过孔 电源地平面 输入阻抗 S参数 

分 类 号：TN41[电子电信—微电子学与固体电子学]