Cu基表面机械合金化制备W颗粒增强复合层的研究  

Fabrication of W Particle Reinforced Composite Layer on Copper Substrate via Mechanical Alloying

作　　者：沈以赴[1] 邓瑞翔 陈成[1] 冯晓梅[1] 韩林轩 田精明 贺春锋 

机构地区：[1]南京航空航天大学,江苏南京210016

出　　处：《稀有金属材料与工程》2016年第4期940-945,共6页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51475232);2013年国家级大学生创新基金项目(201310287041);江苏高校优势学科建设工程资助项目

摘　　要：采用高能行星球磨机在纯铜基体表面制备了具有一定厚度的W颗粒增强复合层。采用SEM、EDS、XRD和显微硬度测试等分析测试技术分析了不同球磨时间下得到的复合层的沉积过程及复合层的显微组织及力学性能,并对复合层的形成机理进行了探讨。结果表明,颗粒增强复合层的厚度在一定球磨时间内达到最大值,之后不再随着球磨时间的增加而增加。然而适当延长球磨时间能改善复合层内增强颗粒和基体间的结合强度,并在一定程度上改善W层的致密度。High-energy planetary ball mill was applied to fabricate W particle reinforced composite layer on the surface of pure copper substrate. Scanning electron microscopy（SEM）, X-ray diffraction（XRD）, energy dispersive X-ray spectroscopy（EDS） and micro-hardness test technique were used to investigate the microstructure and mechanical properties of the coatings prepared with different milling time, and then the mechanism of the formation of the coatings was studied. The results show that the thickness of the particle reinforced layer reaches the maximum within a certain milling time at the selected milling parameters. However, the bonding between reinforcing particles and the substrate could be enhanced through appropriate extension of milling duration, which would simultaneously facilitate the densification in the composite layer.

关 键 词：机械合金化 颗粒增强 复合层 显微组织结构 

分 类 号：TG174.4[金属学及工艺—金属表面处理]