倒装芯片键合头静态力学特性研究与结构优化  

Static mechanical characteristics research and structural optimization of flip chip bonding head

作　　者：宫文峰[1] 黄美发[2] 张美玲[1] 唐亮[3] 

机构地区：[1]桂林电子科技大学海洋信息工程学院,广西北海536000 [2]桂林电子科技大学广西先进设计与制造技术重点实验室,广西桂林541004 [3]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《机械设计》2016年第4期72-77,共6页Journal of Machine Design

基　　金：国家自然科学基金资助项目(51365009);十一五国家重大专项02专项资助项目(2012ZX02601)

摘　　要：键合头是倒装键合设备的核心功能部件,主要用于完成芯片的拾取、传送、蘸胶和键合。针对键合头常因结构刚度不足在冲击载荷的作用下产生较大的结构弹性变形和残余振动的问题,采用有限元法研究了键合头的静态力学特性,并运用基于参数灵敏度技术的优化方法对薄弱环节进行了多目标优化。结果表明:优化前的键合头最大变形量超出了键合头±10μm的设计要求,拾取臂的长悬臂结构刚度不足是导致大变形的主要原因。针对薄弱环节优化后的键合头最大变形量为8.186μm,且结构质量减少了13.2%,满足设计要求。文中研究方法有效改善并提高了键合头的静态力学特性,对键合机整体的优化设计有重要意义。Flip chip bonding head（FCBR） was a core functional component of microelectronic flip chip bonding equipment,which was used to deal with the process of chip picking, dispensing, dipping glue and bonding. The large structure elastic deformation and residual vibration were generated under the impulse load exerted on bonding head, which made the stiffness of bonding head was insufficient. The static mechanical characteristic of bonding head was analyzed using finite element method. The multi-objective optimization analysis of weak link was performed based on parameter sensitivity technology. The result showed that the maximum deformation was ±10 μm beyond the design requirement before optimization, and the lower stiffness of picking arm was main weak link of bonding head. The maximum deformation was 8.186 μm and structure mass reduced by 13.2% after optimization aiming at the weak link, which met the requirement of design. This analysis result indicated that the optimization method can improve and enhance static characteristic of FCBR. It was of a great significance to the bonding machine optimization design.

关 键 词：倒装芯片键合头 静态特性 结构优化 参数灵敏度 

分 类 号：TH122[机械工程—机械设计及理论]