炔基聚酰亚胺杂化树脂的制备与复合材料性能  被引量:1

Preparation and composite properties of ethynylpolyimide hybrid resins

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作  者:朱海荣[1] 黄传进 薛凯[2] 王明存[1] 王志强[3] 轩立新[3] 

机构地区:[1]北京航空航天大学化学与环境学院,北京100191 [2]天津科技大学材料科学与化学工程学院,天津300457 [3]中国航空工业集团公司济南特种结构研究所,高性能电磁窗航空科技重点实验室,济南250023

出  处:《固体火箭技术》2016年第2期259-264,共6页Journal of Solid Rocket Technology

基  金:航空科学基金(20111851013)

摘  要:合成了一种低熔点炔基聚酰亚胺杂化树脂,并作为耐高温复合材料基体,研究了石英布层压复合材料的性能。以4-苯乙炔苯酐(4-PEPA)、3-乙炔苯胺(3-APA)和1,1,3,3-四甲基二硅氧烷(TMDS)为原料,经热处理得到低熔点炔基聚酰亚胺树脂。将炔基聚酰亚胺与苯乙炔封端硅芳炔树脂(BLJ)熔融共混得到具有较低固化温度的炔基聚酰亚胺杂化树脂。结果表明,炔基聚酰亚胺杂化树脂的熔点很低(〈80℃),在80~110℃具有适宜和稳定的粘度,适合复合材料的RTM成型工艺;炔基聚酰亚胺杂化树脂具有很低的固化温度(约125~170℃)。炔基聚酰亚胺杂化树脂具有较高的耐热氧化性(500℃空气气氛中处理10 min失重率小于5%)。炔基聚酰亚胺杂化树脂石英布层压复合材料的玻璃化温度大于350℃,具有很高的高温力学性能,有望应用于航空航天耐热结构材料。In this paper, one kind of novel ethynylpolyimide hybrid resin was prepared, and the propeties of laminate composites reinforced by silica cloth were evaluated.The synthesis was started with 4-phenylethynylphthalic anhydride (4-PEPA), 3-aminophe- nylaeetylene (3-APA) and 1,1,3,3-tetramethyldisiloxane (TMDS). Upon thermal treatment, silicon-containing ethynylpolyimide was prepared in a solid state with 10w melting point. Novol hybrid resins were readily realized by melt blending of ethynylpolyimide and phenylacetylene-terminated polysilylarylacetylene (BLJ).The results reveal that the hybrid resin has a low melting point (〈80℃) ,the improvement of rehological behaviors and processing capability of Resin Transfer Molding ( RTM ). Furthermore for the ethynylpolyimide hybrid (with BLJ), the thermal cure temperature was highly decreased (about 125 -170℃), and the thermal resistance in air was enhanced (mass loss less than 5% affter heat-treated at 500℃ for 10 min in air).The mechanical properties of laminates with silica cloth as reinforcement at high temperature were comparably ideal, and the glass transition temperature ( Tg ) is less than 350℃.The ethynylpolyimide-polysilylarylacetylene hybrid resin is a kind of promising candidate for thermo-strueture mate- rials in aerospace and aviation indusries.

关 键 词:炔基聚酰亚胺 硅芳炔 杂化 催化固化 耐高温基体 

分 类 号:V255[一般工业技术—材料科学与工程]

 

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