SPDT加工对KDP晶体表面温度及应力的影响  

Effect of the SPDT on Surface Temperature and Stress of KDP Crystal

作　　者：杨萍[1] 张晨贵 梁莹林[1] 刘有海[2] 阳红[2] 张连新[2] 栾春红[1] 姜晶[1] 王超[1] 

机构地区：[1]电子科技大学微电子与固体电子学院,成都611731 [2]中国工程物理研究院机械制造工艺研究所,绵阳621900

出　　处：《人工晶体学报》2016年第4期896-900,共5页Journal of Synthetic Crystals

基　　金：中国工程物理研究院超精密加工技术重点实验室开放基金课题(KF14008);电子科技大学中央高校基本科研业务费(A03010023801115);四川省科技计划支撑项目(M110238012014GZ0151)

摘　　要：KDP晶体作为优质的非线性光学材料,具有脆性高、对温度敏感等特性,在单点金刚石切削(SPDT)超精密加工中,微小的温度和应力变化有可能对晶体造成损伤,但是一直未有相关实验报道。本文采用红外热成像仪对SPDT加工过程进行监测,结合Raman光谱技术,研究KDP晶体在SPDT加工前后表面温度和应力的分布变化。大尺寸KDP晶体经过快速微区切削后,在给定的切削工艺条件下,测量出切削部分最高瞬态温度比附近未切削部分高出将近8℃。通过Raman测量,显示切削后晶体表面存在残余拉应力。结合热力耦合模拟仿真,进一步分析了SPDT加工过程动态切削温度对晶体质量的影响,为优化加工参数提供依据。The potassium dihydrogen phosphate（ KDP） is an important optical crystal with brittle and temperature sensitive. Single point diamond cutting（ SPDT） is usually used for the precise machining. In this process,slight temperature and stress change might damage the crystal quality. But it has no report regarding to the temperature and stress related research for the machining. The change of surface temperature and stress of KDP crystal in SPDT were studied by infrared thermal camera and Raman spectrum techniques. The temperature change was found during the process and the maximum transient temperature on the KDP cystal was observed to be about 8 ℃ higher compared to the area of nonmachining. The residual tensile stress on the crystal surface after cutting was measured by confocal Raman microspectroscopy. The influence of dynamic cutting temperature on the crystal quality of SPDT machining process is further analyzed by the simulation. This work provides the parameter optimization for the future work.

关 键 词：KDP晶体 温度原位测量 RAMAN光谱 模拟仿真 

分 类 号：O786[理学—晶体学]