大功耗航天器件散热处理方法的工艺研究  

Study on Cooling Processing Method of Heat Consumption Space Device

作　　者：文大化[1] 李艳茹[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,长春130033

出　　处：《长春理工大学学报（自然科学版）》2016年第1期28-31,共4页Journal of Changchun University of Science and Technology(Natural Science Edition)

摘　　要：在真空环境中,印制板上大功耗器件的散热方法主要采用传导散热,因此增加大功耗器件与印制板接触面积是降低芯片热量的最好办法。如何对大功耗芯片与印制板之间缝隙灌注材料和灌注工艺选择,是解决大功耗器件散热效果直接体现。选用稀释后的DBSF-6101三防保护剂对航天产品印制板上大功耗器件进行温度散热灌注处理的工艺方法,该工艺方法可以解决印制板上大功耗器件在真空环境中散热由辐射散热转变为传导散热,大大降低印制板上大功耗器件表面温度。In vacuum environment, the method to cool device of PCB mainly adopts heat conduction. Thus, best way to reduce the chip heat is to increase the hot consumption device and printing plate contact area. How to choose filling material and filling process is a important problem to solve the consumption device cooling effect. Diluted DBSF-6101 is selected to solve above problem, the test proved the process in this paper can solve hot consumption devices on PCB in vacuum cooling by radiation changing heat conduction. In this method, hot consumption device surface temperature on PCB greatly reduced.

关 键 词：印制板大功耗器件 灌注材料 散热处理 灌注工艺 

分 类 号：V442[航空宇航科学与技术—飞行器设计]