Sn合金的加压等温凝固研究  

Pressurized Isothermal Solidification Study of Sn Alloy

作　　者：赵玉华[1] 刘世龙[1] 王开航 雷洪伟 刘泽辉[1] 

机构地区：[1]沈阳航空航天大学材料科学与工程学院,辽宁沈阳110136

出　　处：《铸造技术》2016年第5期976-978,共3页Foundry Technology

摘　　要：采用加压等温凝固的方法,研究了其对纯Sn及Sn合金组织的影响。结果表明:液态纯Sn分别在312 MPa、499 MPa和749 MPa压力下凝固,液态Sn-Bi和Sn-Bi-Cu合金在749 MPa压力下凝固都得到了等轴晶组织。过热金属液在高压作用下,提高了熔点,产生过冷度,导致金属液在整个体积内凝固,获得了等轴晶组织。The influence of pressurized isothermal solidification on the microstructure of Sn and Sn alloy was studied. The results show that the equiaxed grains in alloy microstructure can be obtained when pure liquid Sn solidifies at 312 MPa,499 MPa and 749 MPa, respectively, and liquid Sn-Bi alloy and Sn-Bi-Cu alloy solidify under the pressure of 749 MPa.The melting point of superheated molten metal is raised under the influence of high pressure, and undercooling increases,which results in molten metal solidification in the entire volume to obtain equiaxed grains.

关 键 词：加压等温凝固 等轴晶 组织细化 过冷度 

分 类 号：TG244.3[金属学及工艺—铸造]