工艺参数对高速镀锡电流效率及镀锡层表面形貌的影响  

Effects of Process Parameters on the Current Efficiency of High-Speed Tin Plating and the Surface Morphology of Tin Coating

作　　者：蔡峰 刘新院 陈爱华 李化龙 

机构地区：[1]江苏省(沙钢)钢铁研究院,江苏张家港215625

出　　处：《电镀与环保》2016年第3期23-26,共4页Electroplating & Pollution Control

摘　　要：采用自制旋转阴极装置模拟带钢的高速运动,并研究了电流密度、阴极转速及Sn^(2+)的质量浓度对甲基磺酸盐高速镀锡电流效率和镀锡层表面形貌的影响。结果表明:提高阴极转速和Sn^(2+)的质量浓度及降低外电流密度,可以提高电流效率;提高阴极转速和降低外电流密度,有利于镀锡层形成多晶态的形貌。电流效率与镀锡层结晶状态有良好的对应关系,电流效率越高,结晶越细致。另外,增大阴极转速能减小扩散层厚度,提高电流密度上限和电流效率,降低Sn2+的质量浓度下限,从而提高生产效率并降低生产成本。Effects of current density, cathode rotation speed and Sn^2＋ mass concentration on the current efficiency of methylsulfonate high-speed tin plating and the surface morphology of tin coating were studied using the self-made rotational cathode apparatus by simulating high-speed strip motion in tin plating process. Results showed that an increase of cathode rotation speed and Sn^2＋ mass concentration, and a decrease of external current density lead to higher current efficiency. And furthermore, the poly-crystallized surface morphology was formed under the conditions of increasing cathode rotation speed and decreasing external current density. Current efficiency has a good correlation with surface morphology of tin coating, the higher the current efficiency, the finer the grains. In addition, increasing cathode rotation speed can reduce the thickness of diffusion layer, and hence increases the current efficiency and the upper limit of current density, and decreases the lower limit of Sn^2＋ mass concentration. Based on these findings, productivity can be improved and production cost can be reduced.

关 键 词：电流效率 表面形貌 电流密度 阴极转速 Sn2+的质量浓度 

分 类 号：TQ153[化学工程—电化学工业]