含裂纹金属板复合材料胶接修补结构残余热应力分析  

THERMAL RESIDUAL STRESS ANALYSIS OF BONDED COMPOSITE REPAIRS TO CRACKED METALLIC PLATE

作　　者：牛勇[1] 穆志韬[1] 李旭东[1] 郝建滨[1] 

机构地区：[1]海军航空工程学院青岛校区,青岛266041

出　　处：《玻璃钢／复合材料》2016年第5期23-29,共7页Fiber Reinforced Plastics/Composites

基　　金：总装"十二五"预研项目(4010901030201)

摘　　要：残余热应力会增大裂纹尖端的应力强度因子SIF,加快疲劳裂纹扩展速率,缩短修补结构的疲劳寿命。利用三维有限元方法,对含裂纹金属板复合材料胶接修补结构中的残余热应力进行了分析,利用虚拟裂纹闭合技术(VCCT)计算了修复结构裂纹尖端的SIF。并以SIF为判据,讨论了补片铺层方向、固化温度、胶层的材料参数对修复结构残余热应力的影响。结果表明,[0°/45°/-45°/90°]s的铺层方式可有效降低残余热应力引起的SIF;残余热应力引起的SIF随着固化温度的升高而线性增加;胶层的材料参数及胶层厚度对残余热应力引起的SIF影响不显著。The thermal residual stress will increase the stress intensity factor（ SIF） of the crack after repair,which may subsequently enhance fatigue crack growth rate,and decrease the fatigue life of repaired structure. In this study,a 3-D finite element method is used to analyse the thermal residual stress of bonded composite repairs to cracked metallic plate and the SIF at the crack front of the repaired structure is computed using the virtual crack closure technique（ VCCT）. Meanwhile,the SIF at the crack tip is chosen as fracture criterion in order to estimate the influence of composite lay-up direction,curing temperature,and adhesive property to thermal residual stress of repaired structure. The obtained results show that the lay-up direction of [0° / 45° /- 45° / 90°]scould effectively decrease the thermal SIF. Meanwhile,the variation of the thermal SIF is approximately linear when curing temperature increases. The material property and thickness of adhesive do not show significant influence on the variation of the thermal SIF.

关 键 词：复合材料胶接修复 残余热应力 固化温度 胶层 有限元分析 

分 类 号：TB332[一般工业技术—材料科学与工程]