用Cu基非晶箔TLP扩散连接TA2接头界面特征与力学性能  

Interfacial Microstructure and Mechanical Properties of TA2 Transient Liquid Phase Bonded TLP Joints Using Cu Amorphous Foils

作　　者：朱春莉[1] 陈思杰[1] 

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454000

出　　处：《热加工工艺》2016年第11期79-82,共4页Hot Working Technology

基　　金：河南省科技攻关项目(142102210434)

摘　　要：在开放环境下,使用氩气保护,采用Cu-Ni-Sn-P系非晶合金箔作为中间层,对TA2工业纯钛进行了不同连接温度的瞬时液相扩散焊。观察了接头界面组织形貌,分析了接头界面元素分布,测试了接头的剪切强度,并对接头进行了断口分析。结果表明:连接接头剪切强度随连接温度的升高先增加后降低,在850℃时具有最高的剪切强度,约为180 MPa,并在断口上生成了Cu Ti、Cu Ti_2等金属间化合物,且断口呈现塑性+脆性混合断裂方式。TA2 titanium sheets were lap joined by transient liquid phase diffusion bonding with different bonding temperatures in argon atmosphere. Cu-Ni-Sn-P amorphous foil was used as interlayer. The joint microstructure was investigated. The element distribution and the shear strength of the joints were tested. The shear fractured surface was analyzed. The testing results show that the shear strength of the joints firstly increases and then decreases with the temperature increasing. The ultimate shear strength of 180 MPa is achieved when the bonding temperature is 850℃, Cu Ti, CuTi2 chemical compounds are observed on the fractured surface by XRD, and the shear fracture surface shows ductile and brittle fracture zones.

关 键 词：TA2 瞬时液相扩散焊 焊接温度 显微组织 力学性能 

分 类 号：TG453.9[金属学及工艺—焊接]