微波组件振动过程失效分析及对策  

Failure Analysis and Strategy of a Microwave Modules in Vibration

作　　者：班亚娟 唐光庆[2] 刘良芳[1] 张建刚[1] 程俊杰[1] 

机构地区：[1]中国电子科技集团公司第二十六研究所,重庆400060 [2]中国人民解放军驻重庆气体压缩机厂军事代表室,重庆400050

出　　处：《压电与声光》2016年第3期508-510,共3页Piezoelectrics & Acoustooptics

摘　　要：电子产品的失效与其所承受的外界应力紧密相关,通过采取设计及工艺改进措施,降低薄弱部位承受的外界应力影响,提高产品的可靠性。通过对某型微波组件在振动试验过程中焊点出现开裂的案例分析,提出了采用镀银铜线软连接、安装孔倒角处理和增加点胶固定等措施,并经量级分别为12g、15g、22.3g(g=10m/s2)的随机振动及正弦扫频振动、温度冲击等试验验证,满足了微波组件在整机上的使用需求,防止在振动中因焊点开裂造成产品失效。The failure of electronic products is closely related with the external stress.The reliability of the products can be increased through improving the design and process as well as reducing the external strees effect on the weak parts.Some measres of the flexible connection of slivering copper wire,chamber angle treatment of mounting hole and adding adhesive dispensing etc.are presented in this paper by analyzing the case of welding spot cracking of a certain type of microwave module during the vibration experiment.These measures are verified by the random vibration tests under the conditions of vibration magnitude of 12 g,15g,22.3g（g=10 m/s2）,the sineswept vibration and the temperature shock test.The results show that the microwave modules can meet the application requirements in the whole systems.

关 键 词：微波组件 焊点开裂 外界应力 措施 

分 类 号：TN63[电子电信—电路与系统]