双硅通孔在线容错方案  

Double-TSV Online Tolerance Scheme

作　　者：梁华国[1] 李黄祺 常郝[2] 刘永[1] 欧阳一鸣[2] 

机构地区：[1]合肥工业大学电子科学与应用物理学院,合肥230009 [2]合肥工业大学计算机与信息学院,合肥230009

出　　处：《计算机辅助设计与图形学学报》2016年第7期1169-1174,共6页Journal of Computer-Aided Design & Computer Graphics

基　　金：国家自然科学基金(61274036;61371025;61474036);安徽省高校省级自然科学研究重大项目(KJ2014ZD12)

摘　　要：三维集成电路是延续摩尔定律的重要手段.针对三维集成电路中硅通孔(TSV)良率不高的问题,提出一种双TSV在线容错方案.该方案采用相互耦合的通道结构来减小TSV的失效概率;通过设计反馈性的泄漏电流关闭结构来实时监控TSV的泄漏电流,以达到自动屏蔽泄漏故障的目的;设计了对称的短暂放电结构,在TSV发生电阻开路故障时实现对输出信号的自动修复.理论分析和实验结果表明,文中方案可在无测试时间和电路端口开销且不中断电路正常工作的前提下,对TSV的泄漏和电阻开路2种故障进行在线容错,有效地提高三维集成电路的良率和可靠性.The technology of 3D ICs is an efficient method for the continuation of Moore's law, however, the yield of through-silicon-vias(TSVs) in 3D ICs isn't satisfactory. To address the problem, a double-TSV online fault-tolerant scheme is proposed. A coupling channels structure is used to reduce the failure probability of TSVs. A leakage current shut down structure is designed to shield the leakage fault automatically by monitoring the leakage current of faulty TSVs in real time. When one TSV occurs resistive open fault, a temporary discharge structure functions to repair the output signal spontaneously. Experimental results show that the proposed scheme can perform online tolerance for the leakage fault and resistive open fault without any consumption of test time and pins of the circuits, and efficiently improve the reliability and yield of 3D ICs while the normal operation of the circuit is not affected.

关 键 词：三维集成电路 硅通孔 在线容错 泄漏故障 电阻开路故障 

分 类 号：TP306.2[自动化与计算机技术—计算机系统结构]