表面活性剂对镀Ti金刚石-Ni复合电沉积行为的影响  

Effect of Surfactant on Coelectrodeposition Behavior of Ti-Coated Diamond-Ni Composite

作　　者：张鹂[1] 王日初[1] 张纯[1] 王乃光[1] 

机构地区：[1]中南大学,湖南长沙410083

出　　处：《稀有金属材料与工程》2016年第5期1271-1277,共7页Rare Metal Materials and Engineering

基　　金：国家军品配套项目(JPPT-125-GH-039)

摘　　要：研究了阴离子表面活性剂十二烷基硫酸钠(SDS,sodium dodecyl sulfate)和阳离子表面活性剂十六烷基三甲基溴化铵(CTAB,cetyl trimethyl ammonium bromide)对镀Ti金刚石-Ni复合电沉积的影响,并结合循环伏安、交流阻抗等电化学方法研究了镀Ti金刚石-Ni镀液中Ni电沉积过程。结果表明:与未镀覆金刚石相比,镀Ti金刚石与Ni层浸润性得到提高。浓度为0.05 g/L的SDS对Ni电结晶过程有抑制作用,而浓度为0.05 g/L的CTAB能促进Ni^(2+)离子转移并加快Ni的电沉积过程。SDS和CTAB都能促进电沉积过程中氢气的析出并细化Ni镀层,同时减少镀层针孔和凹痕。The effects of anionic surfactant（sodium dodecyl sulfate, SDS） and cationic surfactant（cetyl trimethyl ammonium bromide,CTAB） on the coelectrodeposition of Ti-coated diamond-Ni composite plating were studied. The electrolytic deposition behaviour of nickel was investigated using cyclic voltammetry（CV） and electrochemical impedance spectroscopy（EIS）. The results indicate that the diamond coated with Ti exhibits better infiltration when contact with Ni plating in contrast with that without Ti coating. The SDS with a concentration of 0.05g/L inhibits the electrolytic deposition of Ni. However, the CTAB with a concentration of 0.05 g/L promotes the transfer of Ni^2＋ ions and accelerates the electrolytic deposition of Ni. The addition of SDS and CTAB refines the Ni coating and favours the evolution of hydrogen in the course of electrolytic deposition. Moreover, SDS and CTAB both decrease the number of pinhole and pitting in the coating.

关 键 词：复合电沉积 金刚石 循环伏安 交流阻抗谱 表面活性剂 

分 类 号：TG174.4[金属学及工艺—金属表面处理]