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作 者:王文轩[1] 陆光达[1] 张桂凯[1] 杨飞龙[1] 赖新春[1]
出 处:《稀有金属材料与工程》2016年第5期1314-1319,共6页Rare Metal Materials and Engineering
基 金:国家磁约束聚变项目(2013GB110006);国家自然科学基金(11275175)
摘 要:采用AlCl_3-EMIC离子液体在室温下对国产低活性铁素体/马氏体钢(CLAM钢)表面进行镀铝处理。研究了镀前处理对镀层-基体界面的影响。采用SEM、EDS分析了不同电流密度对镀层表面形貌与界面形貌的影响,同时与脉冲电镀所得结果进行了比较。结果表明:在电化学前处理过程中,增大电流密度会增强镀层与基底结合力;电流脉冲的加入可以减弱溶液浓差极化现象,增加表面组织致密性;镀层晶粒大小随电流密度增大而减小,镀层球状组织随电流密度增大而增大。在优化的电镀工艺下(前处理电流密度控制在10 mA/cm^2以上,电镀电流密度控制在10~20 mA/cm^2,对应的电镀时间45~95 min,优选脉冲电流电镀),得到的铝镀层表面光滑,致密,结合力强,厚度可控。To fabricate tritium penetration barrier of aluminizing coating on Chinese low active martensite(CLAM) steel, electroplating of aluminum on CLAM steel from ambient temperature chloroaluminate ionic liquid AlCl3-MEIC(AlCl3-1-ethyl-3-methylimidazolium chloride) was carried out. The adhesion of substrates and aluminum coating with different pretreatment of the substrates was examined. The surface morphology and crystal size of aluminum coating at different current densities were examined by SEM and EDS. The surface morphology of aluminum plated by direct current process was compared with that plated by pulse current process. The results show that the electroplating of aluminum on CLAM steel from AlCl3-MEIC is feasible. The current density of electrical pretreatment influences the adhesion of substrates and aluminum coating. Increasing of the current density can improve the adherence of substrates and aluminum coating. Pulse current plating process can improve the compactness of surface morphology. Particle size of aluminum coating decreases with increasing of current density, while spherical structure of aluminum coating increases. The deposited aluminum coating is smooth and uniform with strong adhesion and controllable thickness by preferable plating techniques, in which the range of current density is 10- 20 mA/cm-2, the electroplating time is 45-95 min, and the pulse current process is prior.
关 键 词:CLAM钢 阻氚涂层 AlCl3-EMIC离子液体 电镀铝
分 类 号:TG174.4[金属学及工艺—金属表面处理]
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