基于专利计量的集成电路制造技术创新能力分布研究  

Technical Innovation Capability Distribution of IC Manufacturing Based on Patentometrics

作　　者：刘云[1] 闫哲[1] 程旖婕 谭龙[1] 

机构地区：[1]北京理工大学管理与经济学院,北京100081

出　　处：《研究与发展管理》2016年第3期47-54,共8页R&D Management

基　　金：国家自然科学基金面上项目"我国专利申请量增长的影响因素及动力机制研究"(71273030);国家国际科技合作专项项目"应对气候变化南南科技合作监测系统构建"(2012DFG11750);北京市科委科技专项"战略性新兴产业前沿技术国际创新资源监测系统"(Z13111000231304)

摘　　要：通过建立集成电路制造技术领域分类体系,确定专利信息检索策略,对德温特专利数据库进行专利信息下载、清理,采用专利计量方法,分析了1974—2013年全球集成电路制造各技术领域专利的时间分布特征,探讨了各技术领域的创新发展趋势;通过"专利地位—专利质量"二维分析矩阵比较分析了集成电路制造各技术领域美国、日本、中国所处的地位.研究发现,中国在集成电路各技术领域的创新能力与美、日等领先国家均有较大差距,未来在重点推动封装技术、退火技术、平坦化工艺3个技术领域创新发展的同时,还应加强对先进技术的引进、消化、吸收、再创新.最后,提出了今后中国集成电路制造重点技术发展方向的若干建议.It firstly designed the technology classification system and search strategy for the identification of integrated circuit （IC） manufacturing. Then, the temporal distribution characteristics of various technical fields of IC manufactur- ing were analyzed by using the Derwent Innovations Index （DII） patent data authorized from 1974 to 2013, and their future development trends were also discussed. Based on the ＂patent position - patent quality＂ two-dimensional analysis matrix, it studied the positions of major countries （ USA, Japan, and China） in various technical fields. The results show that there is a great disparity between China and the leading level of the world in the technical innovation capabili- ty of IC manufacturing. Therefore, China should not only pay more attention to three technical fields of packaging tech- nology, annealing technology and planarization technology, but also strength the introduction, digestion, absorption and re-innovation of advanced technology in IC manufacturing. Finally, suggestions for both policy makers and scholars to facilitate their decision and research of IC manufacturing were provided.

关 键 词：集成电路制造 专利计量分析 技术创新能力 国际比较 

分 类 号：F204[经济管理—国民经济]