不同退火温度下Cu/Ni纳米多层膜的结构与力学性能稳定性  

Microstructural and Mechanical Stability of Cu/Ni Nanoscale Multilayers at Different Annealing Temperatures

作　　者：王尧[1] 朱晓莹[1] 杜军[1] 刘贵民[1] 

机构地区：[1]装甲兵工程学院装备维修与再制造工程系,北京100072

出　　处：《中国表面工程》2016年第3期14-19,共6页China Surface Engineering

基　　金：国家自然科学基金(51401238;51102283)

摘　　要：为研究不同退火温度下Cu/Ni纳米多层膜的结构与力学性能稳定性,采用电子束蒸发镀膜技术在Si(100)基片上沉积不同周期(Λ为4,12,20 nm)的Cu/Ni多层膜,在真空条件下对试样进行温度为200℃和400℃,时间为4 h的退火处理,分析了沉积态(未退火态)与退火态Cu/Ni多层膜纳米压痕硬度、弹性模量与微结构的演变,讨论了不同调制周期Cu/Ni多层膜的热稳定性。结果表明:200℃下4 h退火后,Λ为4,12和20 nm的Cu/Ni多层膜均保持了硬度与弹性模量的热稳定性。而在400℃下4 h退火后,Λ为12 nm的Cu/Ni多层膜出现了硬度和弹性模量的软化现象,硬度由6.21 GPa降低至5.83 GPa,弹性模量由190 GPa降低至182 GPa。这是由于共格界面被破坏,界面共格应力对Cu/Ni多层膜力学性能贡献作用削弱导致的。In order to study the microstructural and mechanical stability of nanoscale Cu/Ni multilayers after annealing at various temperatures, Cu/Ni multilayers with different periods （A=4, 12, 20 nm） were prepared by the electron beam evaporation coating technique on the Si（100） substrate. The samples were subsequently annealed in a vacuum environment at the temperature of 200℃ and 400℃ for 4 h, and the evolution of nano-indentation hardness, modulus and microstructure of multilayers in the as-deposited state and annealing state was analyzed. The thermal stability of Cu/Ni multilayers with different modulation periods were discussed. The results indicate that after annealing at 200℃ for 4 h, Cu/Ni multilayers with A=4, 12 and 20 nm maintain the hardness and elastic modulus thermal stability. After annealing at 400℃ for 4 h, the hardness and elastic modulus softening phenomenon of Cu/Ni multilayers with A=12 nm is observed, the hardness decreases from 6.21 GPa to 5.83 GPa, and the modulus value decreases from 190 GPa to 182 GPa. This is mainly because the coherent structure of Cu/Ni multilayers with A=12 nm is destroyed, and the contribution of coherent stress to mechanical properties is weaken.

关 键 词：Cu/Ni纳米多层膜 力学性能 界面结构 热稳定性 退火温度 

分 类 号：TG174.444[金属学及工艺—金属表面处理]