多处理器片上系统中一种结合二阶导数的温度预测模型  

A Predictive Thermal Model Combined with the Second Derivative for Multiprocessor System-on-Chips

作　　者：魏琳[1] 周磊[1] 吴宁[2] 杨睛[1] 

机构地区：[1]扬州大学信息工程学院,江苏扬州225000 [2]南京航空航天大学电子信息工程学院,江苏南京210016

出　　处：《电子学报》2016年第6期1272-1278,共7页Acta Electronica Sinica

基　　金：国家自然科学基金(No.61376025;No.61301111);江苏省高校自然科学基金(No.13KJB510039);江苏省普通高校研究生科研实践计划项目(No.SJZZ-0182)

摘　　要：区域温度预测是多处理器片上系统(Multi Processor System-on-Chips,MPSo Cs)高效散热的基础.本文以RC热传导(Thermal Resistance and Capacitance,Thermal RC)模型为基础,结合二阶导数提出了一种温度预测模型.该模型不仅可以在较低的运算复杂度下准确预测温度,而且能在固定的预测误差率范围内拓宽预测时间长度,进而减少模型在实际运行中被调用的次数,降低额外功耗.实验结果表明,相比现有的一次导数预测模型,在相同可接受误差率范围内,该模型能将预测时长拓宽至对比模型的1.6倍.同时,当预测时长拓展至2.5s时,该模型的预测准确率比对比模型高3.84%.The regional temperature prediction is the basis of the efficient heat dissipation in multiprocessor system-on-chips （MPSoCs）.Based on the thermal resistance and capacitance （Thermal RC）model,this paper proposed a predic-tive thermal model combined with the second derivative.It predicts the temperature accurately with low complexity,and in-creases the prediction time length within a certain prediction error range to reduce the number of times that the prediction module is invoked and the extra power consumption.Experimental results show that,compared to the existing model com-bined with the first derivative,the proposed model increases the prediction length by 1. 6 times within the same acceptable prediction error range.When the prediction time length is increased to 2. 5 s,the prediction accuracy of the proposed model is 3. 84% higher than that of the contrastive model.

关 键 词：多处理器片上系统(MPSoCs) RC热传导模型 温度预测模型 

分 类 号：TN47[电子电信—微电子学与固体电子学]