超声外场对SiC_p/7085复合材料界面及拉伸性能的影响  

Effect of ultrasound field on interfacial bonding and tensile properties of SiC_p/7085 composites

作　　者：蒋文[1] 李晓谦[1] 黎正华[1] 李畅梓 

机构地区：[1]中南大学机电工程学院,长沙410083

出　　处：《材料科学与工艺》2016年第3期15-21,共7页Materials Science and Technology

基　　金：国家重点基础研究发展计划项目(2010CB731706)

摘　　要：为研究超声辅助制备工艺对SiC_p/7085复合材料界面结合及拉伸性能的影响,用机械搅拌、机械搅拌+超声施振、超声施振3种工艺制备体积分数为10%的SiC_p/7085复合材料.采用扫描电子显微镜(SEM)、能谱(EDS)研究各工艺对SiC_p/7085复合材料的界面微观组织和拉伸性能的影响.实验结果表明:机械搅拌工艺促进大颗粒(80μm)与熔体结合,但产生了粗大Al4C3界面产物包裹层,且难改善小颗粒(37μm)与熔体界面结合差的问题;超声施振能促进界面反应,生成尺寸细小、排列规整、紧密的Mg O、Mg Al2O4界面强化相覆盖层,有效改善小颗粒与熔体界面结合;相比于7085铝合金,机械搅拌不能改善SiC_p/7085复合材料拉伸性能,而超声施振的加入能显著提升材料拉伸性能.In order to study the influence of ultrasound-assisted preparation on interfacial bonding and tensile properties of SiCp/7085 composites, SiCp/7085 composites of 10% particle volume fraction were produced by three kinds of processing methods（mechanical stirring, mechanical stirring ＋ ultrasonic vibrating and ultrasonic vibrating）. Scanning electron microscope （SEM） and energy dispersive spectroscopy （EDS） were used to study the interfacial combinative state and tensile properties of the composites. The results show that mechanical stirring process can promote the combination between the larger particles （80 μm） and melt, while this process leads to wrapping layer composed of thick Al4C3 on interface and has difficulty in improving the poor interface combination between small particles （37 μm） and melt. Ultrasonic vibrating can promote interfacial reaction and effectively improve the combination between small particles and melt by generating interface strengthening phase of MgO, MgAl2O4 with small size, neat and closely arrangement. In comparison to 7085 aluminum alloy, mechanical stirring can not promote tensile properties of SiCp/7085 composites, however, the tensile properties can be improved effectively by treating with ultrasonic process.

关 键 词：超声 SiCp/7085复合材料 界面 结合 拉伸性能 

分 类 号：TB331[一般工业技术—材料科学与工程]