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作 者:胡钦华[1] 郭鹏[1] 杨成春[1] 王素强[1]
机构地区:[1]中国电子科技集团公司第二研究所,山西太原030024
出 处:《电子工业专用设备》2016年第7期24-28,共5页Equipment for Electronic Products Manufacturing
摘 要:为了在平板显示贴附类设备中实现高质量的硬对硬贴合的要求,设计了一种新型气囊贴附机构,并对气囊贴附方式的关键技术进行了详细的研究,依据坐标变换法以及Hertz接触理论推导气囊施加在上基板工件上的压力分布公式,并在此基础上对气囊贴合产生缺陷的原因进行了深入的分析。在气囊贴合产生缺陷的各种因素中,贴合接触区的压力控制不合理是导致众多贴合缺陷的最为关键的因素。In order to achieve the requirement of high-quality hard-on-hard attaching on fitting attached equipment in the flat panel display,we designed a new type of gasbag attached agency and studyed the key technology of the ways the airbag attached in detail. The pressure-distribution formula of the pressure that airbag exerted on substrate workpiece was deduced according to coordinate transformation and Hertz contact theory,on the basis of that,the reasons of defects caused by airbag attaching are deeply analyzed. We can see that the unreasonable of pressure control in attaching contact area is the key factor in all sorts of reasons which causing defects.
分 类 号:TN605[电子电信—电路与系统]
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