提拉法涂胶膜厚均匀性研究  

Research on Film Thickness Homogeneity in Dip Coating

作　　者：谢俊舰 李木军[1] 沈连婠[1] 黄胜洲[1] 

机构地区：[1]中国科学技术大学精密机械与精密仪器系,安徽合肥230026

出　　处：《机械与电子》2016年第7期6-10,共5页Machinery & Electronics

基　　金：国家自然科学基金(50905173)

摘　　要：针对提拉法涂胶工艺中膜厚的均匀性较难控制,影响因素很多的情况。利用流体计算软件Fluent对提拉法涂胶的整个提拉过程进行仿真,同时结合提拉法涂胶实验,探究影响液膜均匀性的2个重要因素:提拉速度和静置时间。仿真结果和实验结果均表明,提拉速度越大,液膜均匀性越差;圆柱基底放入烘箱前,在空气中放置时间越短,膜厚均匀性越好。这对优化提拉法涂胶工艺,提升膜厚均匀性均有重要的意义。In the coating process ,a uniform thin film of photoresist is needed to deposit on the cylindri‐cal substrate by dip coating .And the homogeneity of the thin film is difficult to be controlled due to the fact it is associated with many factors .In this paper we mainly focus on two important factors ：the with‐draw velocity and resting time between dip coating and soft bake .To explore the effect of these two factors the computational fluid dynamics Software -Fluent is employed to simulate the whole coating process .The simulation and experimental results show that the homogeneity of the liquid film would become worse with the increasing of the withdraw velocity .Before the cylindrical substrate is put into the oven ,the homoge‐neity of the liquid film would be better with the decreasing of the resting time .These results would be sig‐nificant for optimizing the dip coating process and enhancing the homogeneity of the liquid film .

关 键 词：提拉法涂胶 液膜均匀性 数值仿真 

分 类 号：TN305.2[电子电信—物理电子学]