某大功率功放的热设计及优化  

Thermal Design and Optimization of High Power Amplifier

作　　者：高利民[1] 贾伟妙[1] 

机构地区：[1]中国电子科技集团公司第五十四研究所,河北石家庄050081

出　　处：《电子机械工程》2016年第3期8-10,34,共4页Electro-Mechanical Engineering

摘　　要：在某大功率固态功放机箱的设计中,功放机箱内各模块的合理布局及散热方案的正确选择能保证机箱内功率管的工作温度小于额定温度。文中利用Icepak软件对机箱设计进行热仿真分析,通过分析仿真结果来优化风道和散热器的参数,再次对优化后的机箱进行热仿真,对比优化前后的设计参数和仿真结果得到在功放机箱减重4.92 kg的同时,功率管的壳温下降了2.2℃,证明了对风道和散热器参数优化的合理性。In the research of a high power amplifier,the work temperature of the power transistor is less than the rated temperature is ensure by the reasonable layout of each module and the correct choice of the cooling scheme.In this paper,the thermal design of the chassis is simulated and analyzed using Icepak,and the airflow pattern and parameters of the heat sink can be optimized according to the simulation results. Another thermal simulation analysis is made to compare with the former results. The simulation shows that the weight of the power amplifier reduces by 4.92 kg,while the case temperature falls by 2.2 ℃. It is validated the rationality of the airflow pattern and parameters of the heat sink.

关 键 词：功放 热设计 强迫风冷 

分 类 号：TK123[动力工程及工程热物理—工程热物理]