微波印制板材料对焊盘的影响  

Effect of Microwave Printed Circuit Board Material on Pad

作　　者：张朝东[1] 

机构地区：[1]中国电子科技集团公司第五十一研究所,上海201802

出　　处：《电子机械工程》2016年第3期52-55,共4页Electro-Mechanical Engineering

摘　　要：随着微波器件微型化和集成化的快速发展,微波器件对微波印制板材料的要求越来越高以满足其性能指标,出现了许多特殊的微波基材,如铜基微带板和铝基微带板。这些微波板材的制造工艺技术较高,在实际使用中受环境因素和加工技术的影响,出现了许多性能问题。文中针对环境试验中出现的模块通道故障进行故障定位和原因分析,通过工艺试验和工艺分析,从焊盘过孔中查找出铜基微波印制板材料的缺陷,对引起材料缺陷的原因进行了分析,并采用新材料排除了故障。With the rapid miniaturization and integration of the microwave devices,the requirements of the microwave printed circuit board materials are increasingly high to meet the performance requirement of the devices. And many special microwave substrates have emerged,such as the copper-based microstrip plate and the aluminum-based microstrip plate. Due to the environment and processing technology,many performance problems of these microwave substrates have appeared in the application. In this paper the fault location and reason analysis of the channel failure in the environmental test are analyzed. The defects of copper-based microwave printed circuit board materials are identified from the pad hole by test and processing analysis. The defect reason is analyzed and new materials are used to solve the problem.

关 键 词：微波印制板 铜基微带板 X射线检测 

分 类 号：TG115[金属学及工艺—物理冶金]