高硅铝合金电镀锡-铋合金镀层  

Electroplating of Tin-Bismuth Alloy Coating on High Silicon Aluminum Alloy

作　　者：黄晓梅[1] 杨卓 李一举 

机构地区：[1]哈尔滨工程大学材料科学与化学工程学院,黑龙江哈尔滨150001

出　　处：《电镀与环保》2016年第4期9-12,共4页Electroplating & Pollution Control

基　　金：中央高校基本科研基金(批准号HEUCF201403018)

摘　　要：在高硅铝合金表面电镀锡-铋合金镀层,并对镀层及镀液的性能进行了测试。结果表明:锡-铋合金镀层呈颗粒状结构,其中Bi元素的质量分数为6.44%,其耐蚀性优于高硅铝合金基体及纯锡镀层的耐蚀性;镀液的整平能力及稳定性都较好,电流效率为82.6%,分散能力为26%,覆盖能力接近100%。Tin-bismuth alloy coating was electroplated on high silicon aluminum alloy, and the coating performance as well as solution performance was tested. Results showed that the tin-bismuth alloy coating exhibit crystal structure, and the mass fraction of Bi element was 6.44%. The corrosion resistance of tin-bismuth alloy coating was better than that of high silicon aluminum alloy substrate and pure tin coating. Moreover, the solution present better leveling power and stability, the current efficiency was 82. 6%, the throwing power was 26% and the covering power approach to 100%.

关 键 词：高硅铝合金 锡-铋合金镀层 电镀 镀层性能 镀液性能 

分 类 号：TQ153[化学工程—电化学工业]