化学镀铜液自动分析补充系统设计  

Design of System for Automatic Analysis and Supplement of Electroless Copper Solution

作　　者：王宝英[1] 

机构地区：[1]重庆电子工程职业学院应用电子学院,重庆401331

出　　处：《电镀与环保》2016年第4期40-42,共3页Electroplating & Pollution Control

摘　　要：设计出一种化学镀铜液自动分析补充系统。通过监测Cu2+浓度、OH—浓度及温度,准确分析化学镀铜液中各组分的消耗量。通过控制电磁阀,及时补充消耗的Cu2+和OH—,维持化学镀铜液成分稳定,进而保证化学镀铜的质量。A system, which was used for automatic analysis and supplement of electroless copper solution, was designed. The consumption quantity of each component contained in electroless copper solution can be analyzed accurately through monitoring Cu^2＋ concentration, OH^- concentration and temperature. Furthermore, through controlling the electromagnetic valve, the consumed Cu^2＋ and OH^- was supplemented in time, and then maintain the electroless copper solution composition stable, thus to guarantee the electroless copper plating quality.

关 键 词：化学镀铜液 监测 分析 补充 

分 类 号：TP399[自动化与计算机技术—计算机应用技术]