圆片测试中的熔丝修调方法研究  

Research of the fuse trimming method in wafer test

作　　者：高剑[1] 赵影[1] 李杰[1] 

机构地区：[1]北京自动测试技术研究所集成电路测试技术北京市重点实验室,北京100088

出　　处：《电子测量技术》2016年第6期15-19,共5页Electronic Measurement Technology

基　　金：北京市自然科学基金委员会-北京市科学技术研究院联合(L150009)资助项目

摘　　要：熔丝修调因工艺简单、速度快,被广泛用于混合信号电路芯片的圆片测试中,但其类型多样,控制电路繁琐,修调受电阻变化的影响且不可恢复,因此精度不易控制,测试效率低。针对此问题,提出一种对串行、并行结构通用的测试系统修调控制电路,展示了减小测试误差的计算方法,最后,改进了传统测试流程,提出了以合并测试步骤及并行测试为基础的简化方法。测试结果表明,该方法操作性强,能够有效提高测试效率和准确率。Fuse trimming test is widely used in wafer test process of mixed signal circuit chip ,however it’s difficult to control test precision and the test efficiency is low because it has many kinds of types ,the control circuit is complex and trimming is easily affected by changing in the resistance .Aiming at the problems ,a test system control circuit for serial and parallel architecture of trimming is put forward ,and a calculation method of reducing test error is displayed . Finally ,the traditional test process is improved and a simplified procedure based on the combined test steps and parallel tests is made out .The test result turns out that this method can effectively improve test efficiency and accuracy .

关 键 词：混合信号电路 修调 熔丝 圆片测试 

分 类 号：TN407[电子电信—微电子学与固体电子学]