端羟基聚醚砜改性TDE-85/DDS体系的研究  

Study on TDE-85/DDS system modified with hydroxyl-terminated poly(ether sulfone)

作　　者：蒋德意[1] 周权[1] 倪礼忠[1] 沈康[1] 徐其磊 

机构地区：[1]华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237

出　　处：《固体火箭技术》2016年第3期407-411,共5页Journal of Solid Rocket Technology

摘　　要：以4,5-环氧四氢邻苯二甲酸二缩水甘油酯(TDE-85)为树脂基体,二氨基二苯砜(DDS)为固化剂,端羟基聚醚砜(PES)为增韧剂,制备了TDE-85/DDS/PES共混体系,对固化树脂的增韧效果进行表征,并通过DSC分析改性环氧树脂基体玻璃化温度与PES含量之间的关系以及PES含量对改性体系固化剂用量的影响。结果表明,加入一定量的PES可与TDE-85形成半互穿网络的均一相,提高环氧树脂的韧性。随着PES含量的增加,改性树脂的玻璃化温度由TDE-85/DDS的195.3℃提高到212.0℃(PES添加量20 phr,固化剂用量70%)。改性体系的玻璃化温度与固化剂的用量有关,PES加入量越多,达到玻璃化温度最高值时,所用固化剂用量越少。随着PES含量的增加,基体树脂耐温性也得到提升。Epoxy resin was roughed by poly （ether sulfone） （PES）and TDE-85/DDS/PES blends were prepared.The mechani- cal properties of the cured resin were studied and relationship between glass transition temperature of epoxy matrix modified with PES and content of PES as well as the effect of PES content on the curing agent amount were researched.The results show that the strength and toughness of epoxy resin could be improved obviously by adding PES with some content and PES has little influence on the modulus of epoxy resin. Also, the Tg of modified epoxy increases from 195.3 ℃ （TDE-85/DDS）to 212 ℃ （PES content 20% and curing agent amount 70%）.The Tg of the epoxy matrix can be affected with the amount of curing agent, the more PES content, the lower curing agent the max Tg need.The temperature resistance is also improved with increase of PES content.

关 键 词：聚醚砜 环氧树脂 改性树脂 玻璃化温度 

分 类 号：V258[一般工业技术—材料科学与工程]