基于C-mount封装的半导体激光器热特性模拟分析  

Thermal Characteristic Simulation and Analysis of Semiconductor Laser Based on C-mount

作　　者：韩立[1] 徐莉[1] 李洋[1] 邹永刚[1] 马晓辉[1] 徐英添 金亮[1] 张贺[1] 

机构地区：[1]长春理工大学高功率半导体激光器国家重点实验室,长春130022

出　　处：《长春理工大学学报（自然科学版）》2016年第3期27-31,共5页Journal of Changchun University of Science and Technology(Natural Science Edition)

基　　金：吉林省科技计划重点项目(20140204028GX;20150204068GX);长春理工大学青年科学基金(XQNJJ-2014-15)

摘　　要：通过对半导体激光器热特性以及散热方式的理论分析,建立了C-mount封装半导体激光器的物理散热模型,针对其在稳态工作条件下的热特性,利用ANSYS有限元软件进行了模拟分析,对ANSYS自建模与外部导入两种建模方式进行分析,发现自建模方式更加精确。通过改变C-mount热沉的厚度,得到了芯片温度的变化规律,并从热流的角度进行分析。最后,通过引入导热性能良好的金刚石膜与石墨烯膜,设计了一种较为理想的复式散热结构。This paper analyzed the theory of thermal characteristics of semiconductor laser and established the physical model of heat dissipation of semiconductor laser of C-mount packaging. Using finite element software of ANSYS to simulated thermal characteristic of semiconductor laser in steady-state, analyzed two methods of modeling including modeling of ANSYS self and external introduction,and discovered the former is more accurate. By changing the thickness of heat sink of C-mount,the article obtained the regulation of chip temperature,analyzed the cause from the perspective of heat flow. In the end,a kind of compound heat dissipation structure is designed by introducing the diamond film and the graphene film with good thermal conductivity.

关 键 词：半导体激光器 C-mount ANSYS 石墨烯 金刚石 

分 类 号：TN305.94[电子电信—物理电子学]