氮化硼/环氧树脂绝缘导热材料的制备及性能表征  

Preparation and Properties Study of Boron Nitride/Epoxy Resin Insulating Thermoconductive Composite

作　　者：马振宁[1] 钟博[2] 王培侨 王逊[1] 汪青杰[1] 

机构地区：[1]沈阳建筑大学理学院,沈阳110168 [2]哈尔滨工业大学(威海)材料科学与工程学院,威海264209

出　　处：《材料导报》2016年第12期65-69,共5页Materials Reports

基　　金：国家自然科学基金(51102060);中国博士后基金(2013M531036);山东省中青年科学家奖励基金(BS2013CL003)

摘　　要：将氮化硼(BN)粉末添加到环氧树脂(EP)中,制备了BN/EP绝缘导热复合材料,并对其热导率、抗拉强度、断面SEM(扫描电子显微镜)以及热失重进行分析,同时探究随着填充量的增加,复合材料的热导率和抗拉强度的变化趋势。结果表明:当20μm的BN的填充量为30%时,由其制备的复合材料的热导率在25℃时达到了0.92W/(m·K),抗拉强度为15.5MPa。并且随着BN填充量的增加,复合材料的热导率也逐渐增加,但抗拉强度逐渐降低。热失重分析说明随着BN填充量的增加,绝缘导热材料的起始分解温度并没有太大的变化,而复合材料的热失重量逐渐减少,分解温度逐渐升高。此外,随着添加BN粒径的增大,复合材料的热导率会增大,而抗拉强度却会减小。The boron nitride（BN）/epoxy resin（EP）insulating thermoconductive composite material were prepared by adding BN powder to EP,and the thermal conductivity,tensile strength,section SEM（scanning electron microscope）and thermal weight loss of the composite were analyzed.At the same time,the thermal conductivity and the change of tensile strength with the increase of filling amount were explored.The results showed that when the filling amount of BN was 30%,the thermal conductivity of the composite at 25 ℃ reached 0.92 W/（m·K）,tensile strength was 15.5MPa.With the increasing of BN filler,the thermal conductivity of the composite was also gradually increasing,but the tensile strength was gradually reducing.The result of thermal weight loss analysis showed that initial thermal decomposition temperature had no obvious change with the increase of BN filler,and thermal weight loss was gradually reducing,decomposition temperature gradually increased.In addition,with the increase of particle size of the BN,the thermal conductivity of the composite increased,while the tensile strength decreased.

关 键 词：绝缘导热复合材料 氮化硼 环氧树脂 性能表征 

分 类 号：O624[理学—有机化学]