一种预处理的优化及计算机软件电镜分析  

Optimization of the Pretreatment Process and SEM Analysis of the Plating

作　　者：田娟[1] 于兴艳[1] 

机构地区：[1]克拉玛依职业技术学院,新疆克拉玛依834000

出　　处：《当代化工》2016年第7期1390-1392,共3页Contemporary Chemical Industry

摘　　要：化学镀方法较电镀方法更适合于在微米级颗粒表面镀覆突起的刺状金属镀层。通过调整镀液组成和施镀工艺参数,发现亲水性和化学镀工艺参数是影响人造金刚石表面化学镀镍磷合金形貌的主要因素。为确保人造金刚石表面呈现良好的亲水性,应当使镀液能够很好的润湿与接触。这一研究对于计算机半导体芯片的硅基的发展具有一定的实际和应用意义。The electroless plating method is more suitable than the electroplating method for plating spiny metal layer on the surface of micron particle surface. Through analysis of plating solution composition and plating process parameters, it＇s found that the hydrophily and electroless plating process parameters are main factors affecting the morphology of plated nickel phosphorus alloy layer on artificial diamond surface. In order to ensure well hydrophily of artificial diamond surface, plating solution should have good wettability and fully contact with artificial diamond surface. The research has a certain practical significance for development of Si substrate for computer semiconductor chip.

关 键 词：电镀方法 微米级金刚石 胶体钯 

分 类 号：TQ23[化学工程—有机化工]