环境友好的ABS板铜催化的铜金属化（英文）  

Environmentally Friendly Copper Metallization of ABS by Cu-Catalysed Electroless Process

作　　者：王旭[1,2] 苗壮[3] 张诚[1] 

机构地区：[1]浙江工业大学,浙江杭州310014 [2]丽水学院,浙江丽水323000 [3]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2016年第7期1709-1713,共5页Rare Metal Materials and Engineering

基　　金：Provincial Natural Science Foundation of Zhejiang under Contract(Y14E010005)

摘　　要：采用一种新型的环境友好的ABS表面微蚀和活化技术以代替传统的铬酸微蚀和钯催化活化技术,经H_2SO_4-MnO_2微蚀后,ABS板表面变得粗糙,在其表面出现大量的羟基和羧基。通过吸附和硼氢化钠的还原,铜粒子沉积在ABS板表面,以取代SnCl_2/PdCl_2胶体催化活化。同时,研究了硫酸铜、硼氢化钠浓度、还原剂温度、还原时间对化学铜ABS板表面粘结强度的影响,最终得到的粘结强度为0.87 k N·m-1。An environment-friendly surface etching and activation technique for ABS surface metallization were investigated as a replacement for conventional chromic acid etching bath and palladium catalyst.After etching by H_2SO_4-MnO_2 colloid,the ABS surfaces became rough;meanwhile the carboxyl and hydroxyl groups were formed on the surface.With absorption and reduction by a sodium borohydride solution,copper particles were deposited on the ABS surface,which serve as a catalyst replacement for Sn Cl_2/Pd Cl_2 colloid.The effects of Cu SO_4 concentration,Na BH_4 concentration,reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated.The average adhesion strengths reaches 0.87 k N·m^-1.

关 键 词：化学沉积 还原剂 ABS板 粘结强度 

分 类 号：TB306[一般工业技术—材料科学与工程]