砷化镓裸芯片环氧导电胶自动贴片技术  

Application of Epoxy Automatic Mounting Technology to GaAs Bare Die

作　　者：宣翔 宋夏[1] 林文海[1] 

机构地区：[1]中国电子科技集团公司第38研究所,安徽合肥230088

出　　处：《电子工艺技术》2016年第4期198-200,共3页Electronics Process Technology

基　　金：国防基础科研项目(项目编号:A1120132016)

摘　　要：砷化镓裸芯片是微电路微波组件的核心器件,砷化镓裸芯片与微波电路基板的连接是微波多芯片组件微组装的关键工序。主要分析了砷化镓裸芯片吸嘴的设计对砷化镓裸芯片自动贴装的影响,并在显微镜下对芯片外观进行了目检,对芯片进行了剪切力强度测试。测试表明,通过设计自动贴片机吸嘴和优化贴片参数,实现了砷化镓裸芯片环氧导电胶自动一次无损贴装。Ga As Bare Die is the core component of Microwave Multichip Modules, and the connection between Ga As bare die and microwave circuit board is the key procedure in Microwave Multichip Modules assembling. Mainly analyze the influence of the nozzle design on automatic mounting of Ga As bare die, and the appearance of die was visual examined under the microscope, die adhesion strength was tested as well. Test shows that automatic mounting Ga As bare die with epoxy resin conductive adhesive was achieved once through the nozzle design and mounting parameters optimization.

关 键 词：砷化镓裸芯片 吸嘴设计 环氧自动贴片 

分 类 号：TN605[电子电信—电路与系统]