SMD器件翼型引脚氧化问题的研究与解决  

Research and Solution of Gull-wing Lead Oxidation Problem of SMD Device

作　　者：张芸 吴晓悦 皮秀国 尉凤枝 陈金龙 

机构地区：[1]北京航天万源科技公司,北京100176

出　　处：《电子工艺技术》2016年第4期213-216,共4页Electronics Process Technology

摘　　要：SMD器件高密度封装翼型引脚,在某种原因下引脚产生氧化,对SMD器件的可焊性以及焊接质量造成影响。为了更好地分析并解决此类问题,对在特定情况下,使用非常规性的处理,去除引脚氧化的工艺方法进行了详细阐述,并介绍了焊接后焊点检查和试验验证的情况。在此基础上,通过TSOP芯片的具体案例,详细描述了工艺流程和操作技巧,为解决SMD器件高密度封装翼型引脚氧化问题提供解决方案,供业界同行参考。Gull-wing lead of SMD device maybe oxidized under a certain condition which will influence the abilities to solder and the soldering quality of the SMD device. In order to analyze and solve this kind of problem, a detailed exposition on the use of unconventional treatment and the process technique for removing pin oxidation under a special condition were introduced, the inspection and test of the solder joint after soldering was also introduced. On the specific case TSOP chips, describe the process flow and operating skills to solve Gull-wing Lead oxidation problem of SMD device, provide the reference for other researchers.

关 键 词：焊接 翼型引脚器件 氧化问题 

分 类 号：TN605[电子电信—电路与系统]