纳米SiO_2在化学镀Ni-P合金镀液中的分散性研究  

Dispersity of Nano-SiO_2 in the Electroless Ni-P Alloy Plating Solution

作　　者：陈尔跃[1] 翟方慧 徐娟[1] 

机构地区：[1]齐齐哈尔大学,黑龙江齐齐哈尔161006

出　　处：《电镀与精饰》2016年第8期1-4,13,共5页Plating & Finishing

基　　金：黑龙江省高校科研创新团队项目(项目编号2012TD012)

摘　　要：采用红外-紫外-可见分光光度计法研究了不同表面活性剂、配位剂、纳米SiO2和p H对纳米粒子在溶液中的分散性和稳定性的影响;讨论了在不同温度和纳米粒子含量下,纳米粒子在铜表面的沉积速度。实验结果表明,化学复合镀Ni-P合金最佳工艺及操作条件是表面活性剂为5 g/L十二烷基硫酸钠,配位剂为13 g/L醋酸钠,2 mL/L乳酸,pH为5.0～5.5,3 g/L纳米SiO2,θ为80～85℃。The effects of different surfactants,ligands,nano-SiO2 and p H on the dispersity and stability of the nano-particles in the aqueous solution were studied by infrared-ultraviolet-visible spectrophotometry.The plating velocity of the nano-particles on the surface of Cu substrates were discussed at different temperatures and contents. The experimental results showed that the optimal process and operating conditions of electroless composite plating Ni- P alloys were obtained,including SDS as surfactants（ 5 g / L）,Na Ac as ligands（ 13 g / L）,lactic acid（ 2 m L / L）,p H（ 5. 0 ～ 5. 5）,nano-SiO2（ 3 g /L） and temperature（ 80 ～85 ℃）.

关 键 词：分散 纳米SIO2 化学复合镀 分光光度法 

分 类 号：TQ153.12[化学工程—电化学工业]