铜合金化学抛光技术研究进展  

Research Process on Chemical Polishing of Copper Alloys

作　　者：李树白[1,2] 马迪[3,2] 周熙雯[3] 朱巧勇 徐龙贵[3] 陈欣[3] 刘鑫[3] 侯丹丹[3] 张听雨 

机构地区：[1]常州工程职业技术学院化学工程技术系,江苏常州213164 [2]常州市贝克曼迪金属表面科技有限公司技术开发处,江苏常州213000 [3]江苏理工学院化学与环境工程学院,江苏常州213001

出　　处：《电镀与精饰》2016年第8期14-17,共4页Plating & Finishing

基　　金：江苏省高校"青蓝工程";常州市科技计划项目CE20155009;常州市科技计划项目CE20155049

摘　　要：综述了铜合金化学抛光的应用现状,硝酸及硝酸盐体系、过氧化氢体系抛光液中各组分的作用,存在的问题及其解决方案。指出目前铜合金化学抛光工艺存在的溶液稳定性和环境污染问题,通过对铜合金不同化学抛光工艺的分析,探讨了绿色环保型铜合金化学抛光工艺是今后的发展方向。The research development of chemical polishing of copper alloys was reviewed. The roles of the components in the polishing liquids for the different treatments were studied,such as nitric acid and nitrate systems,hydrogen peroxide system. The existing problems and corresponding solutions were also introduced. The problems of solution stability and environmental pollution existing in the chemical polishing process of copper alloys were pointed out at present. The green,environment-friendly polishing process was discussed to be the development direction in the future,according to the comparative analysis of different chemical polishing systems.

关 键 词：铜合金 化学抛光 环境保护 表面处理 

分 类 号：TG175.3[金属学及工艺—金属表面处理]