基于Fluent的集合式并联电容器内部温度场仿真分析  

Internal Temperature Field Simulation Analysis of Assembled Shunt Capacitor Based on Fluent

作　　者：华征[1] 侯智剑 戚岭娜 林浩[2] 倪学锋[2] 郭飞[3] 王子建[1] 徐志钮[1] 

机构地区：[1]华北电力大学河北省输变电设备安全防御重点实验室,河北保定071003 [2]中国电力科学研究院,湖北武汉430074 [3]国网宁夏电力公司电力科学研究院,宁夏银川750002

出　　处：《电力电容器与无功补偿》2016年第4期37-42,共6页Power Capacitor & Reactive Power Compensation

基　　金：中央高校基本科研业务费专项资金资助(2015MS92);国家电网公司科技项目(GY71-14-052)

摘　　要：温度是影响电容器运行性能及寿命的关键因素,为了获得集合式并联电容器内部的温度场分布,论文分析了集合式并联电容器内部结构及热量的产生和散失机理,在ANSYS Workbench 15.0中建立了集合式并联电容器温度场三维仿真模型,并利用有限体积法进行了求解,得到了集合式并联电容器的内部温度场分布、外壳温度和最热点温度,仿真结果及方法可以为集合式并联电容器散热结构的优化设计及内部最热点温度的控制提供参考。Temperature is a key factor affecting performance and operation life of the capacitor. For obtaining the temperature field distribution inside the assembled shunt capacitor,in this paper,the internal structure and mechanism of heat generation and loss of the capacitor are analyzed. The three- dimensional simulation model of the temperature field of the capacitor is set up in ANSYS Workbench 15.0 and is solved by finite volume method （FVM） and the internal temperature filed distribution,shell temperature as well as the temperature and position of the hottest spot of the assembled shunt capacitor are obtained. The simulation result and method can provide reference for optimization design of radiation structure and control of the internal hottest spot temperature of the capacitor.

关 键 词：集合式并联电容器 温度场 FLUENT 仿真分析 

分 类 号：TM53[电气工程—电器]